Ngophuhliso olukhawulezayo lweshishini lehlabathi labathengi be-elektroniki, iimveliso zombane zabathengi ziphucula ukuya kudityaniswa okuphezulu kunye nokuchaneka okuphezulu.Amalungu angaphakathi eemveliso ze-elektroniki aya esiba mancinci kwaye amancinci, kwaye iimfuno zokuchaneka kunye nokudityaniswa kwe-elektroniki ziya zinyuka ngokunyuka.Uphuhliso lweteknoloji yokwenziwa kwelaser ephucukileyo lwazise izisombululo kwiimfuno ezichanekileyo zokusetyenzwa kweshishini lombane.Ukuthatha inkqubo yokuvelisa iifowuni eziphathwayo njengomzekelo, iteknoloji yokucubungula i-laser ingene kwi-screen cutting, ukusika ikhamera yekhamera, ukuphawula uphawu, i-welding yecandelo langaphakathi kunye nezinye izicelo.KwiSemina ka-2019 malunga nokusetyenziswa kweteknoloji yokuvelisa i-laser kwishishini, iingcali zenzululwazi kunye nezobugcisa ezivela kwiYunivesithi yaseTsinghua kunye neShanghai Institute of Optics kunye noomatshini beChinese Academy of Sciences baqhube ingxoxo enzulu malunga nokusetyenziswa kwangoku ukuveliswa kwe-laser ekuqhubeni ngokuchanekileyo kweemveliso zombane zabathengi.
Ngoku mandikuthathe uhlalutye usetyenziso oluthandathu lwelaser ekhawulezayo ekusetyenzweni ngokuchanekileyo komzi-mveliso we-elektroniki wabathengi:
I-1.I-laser ekhawulezayo yokuvelisa i-ultra-fine ekhethekileyo: i-ultra fast laser micro nano processing yi-ultra-fine iteknoloji ekhethekileyo yokuvelisa, ekwazi ukucubungula izinto ezikhethekileyo ukufezekisa izakhiwo ezikhethekileyo kunye ne-optical optical, umbane, oomatshini kunye nezinye iipropati.Nangona le teknoloji ingasakwazi ukuthembela kwizinto zokwenza izixhobo, yandisa iintlobo zezixhobo ezicutshungulwayo, kwaye ineenzuzo zokunganxibi kunye nokuguqulwa.Kwangaxeshanye, kukho iingxaki ekufuneka zisonjululwe kwaye ziphuculwe, ezifana nokuhanjiswa kwamandla kunye nokusetyenziswa kakuhle, amandla e-laser kunye nokukhethwa kwe-wavelength ye-absorption, ukuchaneka kwendawo yokunikezelwa, imodeli yesixhobo, ukusebenza kakuhle kunye nokuchaneka."Unjingalwazi sunhongbo weYunivesithi yaseTsinghua ukholelwa ukuba ukwenziwa kwelaser kusalawulwa zizixhobo ezikhethekileyo, kwaye ukwenziwa kwe-macro kunye ne-micro nano kwenza imisebenzi yabo. Kwixesha elizayo, i-ultrafast laser yokuvelisa imveliso ekhethekileyo inamandla amakhulu ophuhliso kwicala le-elektroniki eguquguqukayo, indawo. i-optical components kunye ne-template transfer, i-quantum chips kunye neerobhothi ze-nano. Isalathiso sophuhliso lwexesha elizayo lokwenziwa kwe-laser ye-ultrafast iya kuba yi-high-tech, iimveliso ezongezelelweyo eziphezulu, kwaye zizame ukufumana impumelelo kwishishini. "
I-2.Hundred watt ultrafast fiber lasers kunye nokusetyenziswa kwazo: kwiminyaka yamuva, i-fiber lasers ye-ultrafast isetyenziswe ngokubanzi kwi-electronics yabathengi, amandla amatsha, i-semiconductors, amayeza kunye nezinye iinkalo kunye nemiphumo yazo ekhethekileyo yokucubungula.Ibandakanya ukusetyenziswa kwe-ultrafast fiber laser kwimimandla emihle ye-micromachining efana nebhodi yesekethe eguquguqukayo, umboniso we-OLED, ibhodi ye-PCB, ukusika i-anisotropic yesikrini sefowuni yeselula, njl.Kuqikelelwa ukuba umthamo wentengiso iyonke ye-laser ye-ultrafast iya kudlula iibhiliyoni ezi-2 zeedola zaseMelika ngo-2020. Okwangoku, eyona nto iphambili kwimakethi yi-laser eqinile, kodwa ngokunyuka kwamandla e-pulse ye-ultrafast fiber lasers, isabelo I-laser fibers ye-ultrafast iya kunyuka kakhulu.Ukuvela komndilili ophakamileyo wamandla e-ultrafast fiber lasers amakhulu kune-150 W kuya kukhawulezisa ukwandiswa kwemarike yee-laser ze-ultrafast, kunye ne-1000 W kunye ne-MJ femtosecond lasers ziya kungena ngokuthe ngcembe kwimarike.
I-3.Ukusetyenziswa kwe-laser ye-ultrafast kwi-glass processing: ukuphuhliswa kwe-teknoloji ye-5g kunye nokukhula ngokukhawuleza kweemfuno ze-terminal kukhuthaza ukuphuhliswa kwezixhobo ze-semiconductor kunye nobuchwepheshe bokupakisha, kunye nokubeka phambili iimfuno eziphezulu zokusebenza kunye nokuchaneka kokulungiswa kweglasi.Itekhnoloji yokucubungula i-laser ye-Ultrafast inokusombulula ezi ngxaki zingentla kwaye ibe yinto ephezulu yokukhetha i-glass processing kwi-5g era.
4.Ukusetyenziswa kwe-laser yokusika ngokuchanekileyo kwishishini le-elektroniki: ukusebenza okuphezulu kwe-fiber laser kunokuqhuba isantya esiphezulu kunye nokuchaneka okuphezulu kwe-laser ukusika, ukugrumba kunye nezinye ii-laser micro machining ngokwemizobo yoyilo oluchanekileyo olucekethekileyo olunodonga olulinganayo lombhobho olingana nobubanzi kunye umbhobho okhethekileyo, kunye nokusikwa kwendiza echanekileyo yefomathi encinci.Le yokugqibela sisixhobo se-laser micromachining esinesantya esiphezulu kunye nesichanekileyo esikhethekileyo kwinqwelomoya echanekileyo, izixhobo ezinodonga olucekeceke, ezinokucubungula isinyithi esingenasici, i-aluminium alloy, i-alloy yobhedu, i-tungsten, i-molybdenum, i-lithium, i-magnesium aluminium alloy, i-ceramics kunye nezinye izinto zendiza. esetyenziswa rhoqo kwindawo yezixhobo zombane.
I-5.Ukusetyenziswa kwe-laser ye-ultrafast ekuqhutyweni kwesikrini esikhethekileyo: i-iphonex ivule indlela entsha yesikrini esibanzi esinemilo ekhethekileyo, kwaye yakhuthaza nenkqubela phambili eqhubekayo kunye nophuhliso lweteknoloji yokusika isikrini esikhethekileyo.UZhu Jian, umphathi wombono we-laser ka-Han kunye nesebe leshishini le-semiconductor, wazisa i-Han ezimeleyo ephuhliswe i-icicles diffraction iteknoloji ye-beam yamahhala.I-teknoloji ithatha inkqubo ye-optical yasekuqaleni, enokwenza amandla asasazwe ngokulinganayo kwaye aqinisekise umgangatho ohambelanayo wecandelo lokusika;Yamkela iskimu sokucalula esizenzekelayo;Emva kokuba isikrini se-LCD sinqunyulwe, akukho nto i-particle splash phezu komhlaba, kwaye ukuchaneka kokusika kuphezulu (<20 μ m) Ubushushu obuphantsi (<50 μ m) kunye nezinye iingenelo.Le teknoloji ilungele ukusetyenzwa kwesipili esincinci, ukusika iglasi encinci, ukugrumba isikrini seLCD, ukusika iglasi yemoto kunye nezinye iindawo.
I-6.I-Technology kunye nokusetyenziswa kwe-laser printing conductive circuits ebusweni be-ceramic materials: izinto ze-ceramic zineenzuzo ezininzi, ezifana ne-conductivity ephezulu ye-thermal, i-dielectric ephantsi, iipropati ezinamandla zomatshini, ukusebenza kakuhle kwe-insulation kunye nokunye.Ziye zaphuhliswa ngokuthe ngcembe zaba yi-substrate yokupakisha efanelekileyo kwisizukulwana esitsha seesekethe ezidibeneyo, iimodyuli zemodyuli ze-semiconductor kunye neemodyuli zamandla e-elektroniki.Itekhnoloji yokupakishwa kwebhodi yesekethe yeCeramic nayo ixhalabile kwaye iphuhliswe ngokukhawuleza.Itekhnoloji ekhoyo yokwenziwa kwebhodi yesekethe yeceramic ineziphene ezithile, ezifana nezixhobo ezibizayo, umjikelo wemveliso omde, ukungonelanga kwezinto ezahlukeneyo, nto leyo ethintela uphuhliso lobugcisa nezixhobo ezinxulumeneyo.Ngoko ke, uphuhliso lwethekhnoloji yokuvelisa ibhodi yesekethe yeceramic kunye nezixhobo ezinamalungelo azimeleyo epropathi enomgangatho ophezulu wokuqonda kubaluleke kakhulu ekuphuculeni inqanaba lobugcisa laseTshayina kunye nokhuphiswano olungundoqo kwinkalo yokwenziwa kombane.
Ixesha lokuposa: Jul-08-2022