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ECLC6045 Precision Laser Cutting Machine for Hard Brittle Materials Featured Featured
  • ECLC6045 Precision Laser Cutting Machine for Hard Brittle Materials
  • ECLC6045 Precision Laser Cutting Machine for Hard Brittle Materials
  • ECLC6045 Precision Laser Cutting Machine for Hard Brittle Materials

ECLC6045 Precision Laser Cutting Machine for Hard Brittle Materials

Inkcazelo emfutshane:

Umatshini wokusika we-laser ochanekileyo wezinto ezinzima kunye ne-brittle zisetyenziselwa i-laser micromachining yobunzima obuphezulu kunye nezixhobo eziphezulu ze-brittle, ezifana ne-ceramics, isafire, idayimane, i-calcium steel, i-tungsten steel, i-aluminium nitride, i-silicon nitride, i-gallium arsenide kunye nezinye izinto.


  • Ububanzi bomthungo omncinci wokusika:15 ~ 35um
  • Ukuchaneka okuphezulu koomatshini:≤±10um
  • Umgangatho olungileyo wokusika:Ukusika okugudileyo, indawo encinci echaphazelekayo yobushushu, i-burr encinci kunye ne-edge chipping ＜ 15um
  • Ukucokiswa kobungakanani:ubuncinci besayizi yemveliso yi-100um

    • Iinkcukacha zeMveliso

    Umatshini wokusika we-laser ochanekileyo wezinto ezinzima kunye neziqhekezayo

    Umatshini wokusika we-laser oqinileyo luhlobo oluchanekileyo lokusika umatshini wokusika we-laser, osetyenziselwa ukusika, ukubhola, ukubeka, ukuhlamba kunye nezinye i-laser micromachining yenqwelomoya enzima kunye ne-brittle impahla okanye izixhobo eziqhelekileyo zomphezulu, ezifana ne-MIM yokubukela i-ring ring. ifowuni yasemva kwekhava ye-ceramic ukwenza i-ceramic, i-ceramic plate slotting, i-sapphire drilling, i-tungsten steel sheet sheet ukusika kunye nokwenza, i-zirconia ceramic scribing kunye nokwenza ukomba, njl Ilayibrari ye-laser yobugcisa belayibrari kunye nenkqubo yokulawula intshukumo ye-multi-axis, ngokuvuleka okuphezulu, uzinzo oluhle kunye nokusebenza okulula.

     

    IiParameters zobuGcisa

    Esona santya siphezulu sokusebenza 1000mm/s(X) ;1000mm/s(Yl&Y2) ;50mm/s(Z);
    Ukubeka ukuchaneka ±3um (X) ±3um (Y1&Y2) ;±5um (Z);
    Ukuphindaphinda ukuchaneka kokubeka ±umlum (X) ;±lum(Y1&Y2) ;±3um(Z）；
    Izinto zokutshiza IAlumina & zirconia & aluminium nitride & nesilicon nitride & neDayimane &
    Sapphire & Silicon & gallium arsenide & tungsten steel, njl;
    Izinto eziphathekayo eludongeni 0 ~ 2.0±0.02mm;
    Uluhlu lomatshini wendiza 300mm * 300mm; (inkxaso yokulungelelanisa iimfuno zefomathi enkulu)
    Uhlobo lweLaser Ifayibha laser;
    Ubude beLaser 1030-1070±10nm;
    amandla laser CW1000W&QCW150W& QCW300W& QCW450W ukhetho
    Unikezelo lombane lwezixhobo 220V± 10%, 50Hz;AC 20A (i-breaker circuit main);
    Ifomathi yefayile DXF, DWG;
    Imilinganiselo yezixhobo 1280mm*1320mm*1600mm;
    Ubunzima bezixhobo 1500Kg

    Isampulu uMboniso

    ECLC6045-2Umda wosetyenziso

    I-Laser micromachining yeekeramics, isafire, idayimani kunye nentsimbi yecalcium, ubunzima obuphezulu kunye nenqwelomoya enobuqhophololo kunye nezixhobo ezigoso rhoqo.

    Ukuchaneka okuphezulu komatshini

    Umthungo omncinci wokusika ububanzi: 15 ~ 30um

    1 Ukuchaneka okuphezulu koomatshini: ≤ ± 10um

    Umgangatho olungileyo wokusika: ukusika okugudileyo, indawo encinci echaphazelekileyo kubushushu, i-burr encinci kunye ne-edge chipping ＜ 15um

    Ukucokiswa kobungakanani: ubuncinci besayizi yemveliso yi-100um

    Ukuziqhelanisa okunamandla

    1.Unesakhono sokusika i-laser, ukugrumba, ukubeka, ukumakisha kunye nezinye izakhono zokuqhuba kakuhle kwinqwelomoya kunye nezixhobo zomhlaba ezigobileyo.

    2.Can umatshini we-alumina, i-zirconia, i-aluminium nitride, i-silicon nitride, idayimani, isafire, i-silicon, i-gallium arsenide kunye nentsimbi ye-tungsten

    3.Ixhotyiswe nge-self-developed drive direct drive mobile double drive precision movement platform, iqonga legranite, i-aluminium alloy granite beam yokukhetha.

    4.Nikeza umsebenzi ozikhethelayo, onje ngesikhululo esiphindiweyo & neSimo esiBonakalayo & nesondla ngokuzenzekelayo kunye nenkqubo yokothula & iliso eliguqukayo njl.njl.

    5.Ixhotyiswe ngokuziphuhlisa ubude kunye nobude obufutshane bokugxila, umbhobho obukhali & nozzle osicaba kunye nentloko yokusika i-laser

    6.Ixhotyiswe ngenkqubo yombhobho yokwamkela kunye nokususwa kothuli

    7.Nikeza isakhelo soxinzelelo esiziphuhlisileyo kunye nesakhelo soxinzelelo oluzinzileyo kunye ne-vacuum adsorption & nepleyiti yobusi, njl njl.

    8.Ixhotyiswe nge-2D kunye ne-2.5D kunye ne-3D CAM inkqubo yesoftware ye-laser micromachining

    Uyilo oluguquguqukayo

    1.Landela ingqikelelo yoyilo lwe-ergonomics, ethambileyo kwaye emfutshane

    2.Isoftware eguquguqukayo kunye nokwabiwa komsebenzi wehardware, ukuxhasa uqwalaselo lomsebenzi owenziweyo kunye nolawulo lwemveliso olukrelekrele

    3. Inkxaso yoyilo oluyilayo oluncomekayo ukusuka kwinqanaba lecandelo ukuya kwinqanaba lenkqubo

    4.Open ulawulo & laser micromachining inkqubo software lula ukusebenza & interface enembile

    Isiqinisekiso sobugcisa

    I-CE

    ISO9001

    I-IATF16949

  • Ngaphambili:
  • Okulandelayo:
    • Bhala umyalezo wakho apha kwaye uwuthumele kuthi

    Iindaba ezinxulumeneyo

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