Umatshini wokusika we-laser wensimbi echanekileyo ochanekileyo
Umatshini wokusika we-laser wensimbi echanekileyo ochanekileyoluhlobo lwe-laser micromachining esetyenziselwa ngokukodwa ukusika, ukugrumba kunye ne-grooving insimbi engenasici, i-alloy iron eqinile kunye nezinye izinto ngaphambi nasemva konyango lomphezulu.Okufana nokusika kunye nokwenza ishidi lensimbi engenasici, ukusika kunye nokwenziwa kwe-alloy sheet yentsimbi, ukusika kunye nokwenza i-chip PVD ephethe i-alloy steel carrier, ukusika kunye nokwenziwa kwe-spherical stainless sheet sheet, ukusika kunye nokwenza ishidi lensimbi engenasici emva kwe-PVD, ukusika. kunye nokwenza i-silicon sheet sheet, ukusika kunye nokwenziwa kweengxenye zesakhiwo sefowuni ephathwayo, njl njl.
IiParameters zobuGcisa
Esona santya siphezulu sokusebenza | 1000mm/s(X) ;1000mm/s(Yl&Y2) ;50mm/s(Z); |
Ukubeka ukuchaneka | ±3um (X) ±3um (Y1&Y2) ;±5um (Z); |
Ukuphindaphinda ukuchaneka kokubeka | ±1um(X) ;±1um (Y1&Y2) ;±3um(Z); |
Izinto zokutshiza | Ukuchaneka kwensimbi engenasici kunye nentsimbi eqinile ye-alloy ngaphambi okanye emva konyango lomphezulu; |
Izinto eziphathekayo eludongeni | 0~2.0±0.02 mm; |
Uluhlu lomatshini wendiza | 450mm * 600mm |
Uhlobo lweLaser | Ifayibha laser; |
Ubude beLaser | 1030-1070±10nm; |
amandla laser | I-CW200W&250W&300W&500W&1000W&QCW150W yokhetho |
Unikezelo lombane lwezixhobo | 220V±10%, 50Hz;AC 20A (i-breaker circuit main); |
Ifomathi yefayile | DXF, DWG; |
Imilinganiselo | 1280mm*1320mm*1600mm; |
Ubunzima bezixhobo | 1500Kg |
Isampulu uMboniso
Umda wosetyenziso
I-Laser micromachining yenqwelomoya kunye nezixhobo ezigobileyo zentsimbi echanekileyo kunye nonyango lwentsimbi eqinile.
Ukuchaneka okuphezulu komatshini
1.Ububanzi bokusika umthungo omncinci: 15 ~ 30um
2.Ukuchaneka okuphezulu komatshini: ≤ ± 10um
3.Umgangatho olungileyo wokusika: ukusika okugudileyo & indawo encinci echaphazelekayo yobushushu kunye ne-burr encinci
4.Ubungakanani bokucocwa: ubuncinci bemveliso yi-20um
Ukuziqhelanisa okunamandla
1.Unesakhono sokusika i-laser, ukugrumba, ukubeka, ukumakisha kunye nezinye izakhono zokuqhuba kakuhle kwinqwelomoya kunye nezixhobo zomhlaba ezigobileyo.
2.Ungakwazi umatshini we-laser micromachining yenqwelomoya kunye neendawo ezigobileyo
3.Ixhotyiswe nge-self-developed drive direct drive mobile double drive precision movement platform, iqonga legranite, i-aluminium alloy granite beam yokukhetha.
4.Nikeza umsebenzi ozikhethelayo, onje ngesikhululo esiphindiweyo & neSimo esiBonakalayo & nesondla ngokuzenzekelayo kunye nenkqubo yokothula & iliso eliguqukayo njl.njl.
5.Ixhotyiswe ngokuziphuhlisa ubude kunye nobude obufutshane bokugxila, umbhobho obukhali & nozzle osicaba kunye nentloko yokusika i-laser
6.Ixhotyiswe ngenkqubo yombhobho yokwamkela kunye nokususwa kothuli
7.Nikeza isakhelo soxinzelelo esiziphuhlisileyo kunye nesakhelo soxinzelelo oluzinzileyo kunye ne-vacuum adsorption & nepleyiti yobusi, njl njl.
8.Ixhotyiswe nge-2D kunye ne-2.5D kunye ne-3D CAM inkqubo yesoftware ye-laser micromachining
Uyilo oluguquguqukayo
1.Landela ingqikelelo yoyilo lwe-ergonomics, ethambileyo kwaye emfutshane
2.Isoftware eguquguqukayo kunye nokwabiwa komsebenzi wehardware, ukuxhasa uqwalaselo lomsebenzi owenziweyo kunye nolawulo lwemveliso olukrelekrele
3. Inkxaso yoyilo oluyilayo oluncomekayo ukusuka kwinqanaba lecandelo ukuya kwinqanaba lenkqubo
4.Open ulawulo & laser micromachining inkqubo software lula ukusebenza & interface enembile
Isiqinisekiso sobugcisa
I-CE
ISO9001
I-IATF16949