Ukusetyenziswa kweLaser Cutting kwi-Medical Device Manufacturing

Ukusetyenziswa kweLaser Cutting kwi-Medical Device Manufacturing

Itekhnoloji yokusika iLaser ilungele kakhulu ukusika iblade, i-shaft echanekileyo, i-stent, i-sleeve, kunye nenaliti engaphantsi kwecutaneous.Ukusika iLaser ngokuqhelekileyo kusebenzisa i-nanosecond, i-piccosecond okanye i-femtosecond pulse laser ukutshisa ngokuthe ngqo umphezulu wezinto ngaphandle kwenkqubo yonyango, kwaye indawo yayo echaphazelekayo yobushushu yeyona incinci.Itekhnoloji inokuqonda ukusikwa kwe-10 ubungakanani besici se-micron kunye nobubanzi benotshi.

iindaba723 (1)
Umatshini wokusika weLaser nawo usetyenziswa kwinaliti, i-catheter, isixhobo esifakelwayo kunye nesixhobo esincinci sokulungiswa komphezulu kunye nokugrumba.Iilaser ze-Ultrashort pulse (USP) zisetyenziswa ngokuqhelekileyo.Ngenxa yokuba ixesha elifutshane le-pulse liyakwazi ukususa izinto ezisebenzayo ngakumbi, oko kukuthi, ngokukhutshwa kwamandla angaphantsi, umphumo ococekileyo wokusika unokufumaneka, kwaye phantse akukho mfuneko yokuthunyelwa kwe-post-processing.Umatshini wokusika i-Laser kwinkqubo yokucoca i-micro ayikhawulezi ngokukhawuleza, kodwa yinkqubo echanekileyo kakhulu.Isicelo esiqhelekileyo, sisebenzisa i-femtosecond ultrashort pulse laser ukucubungula ukuthungwa komphezulu wetyhubhu yepolymer, sinokufikelela ubunzulu obuchanekileyo bokuthungwa kunye nokulawula ukuphakama komgangatho.iindaba723 (2)

Ukongeza, inkqubo yomatshini wokusika i-laser inokucwangciswa ukuba isebenze ngeenxa zonke, imingxuma yesikwere okanye i-oval ukunceda ukulawula ukuhanjiswa kweziyobisi ngenaliti.Iindidi ezahlukeneyo zezakhiwo ezincinci zisenokwenziwa kwizinto ezahlukeneyo, kubandakanya isinyithi, iipolima, iiseramikhi kunye neglasi.

 


Ixesha lokuposa: Jul-23-2021

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